| 摘要 |
PURPOSE:To provide a semiconductor device, in which an increase to a high temperature of the temperature of semiconductor element itself due to heat generated from a semiconductor element is prevented effectively and the semiconductor element can be operated normally and stably for a prolonged term. CONSTITUTION:A semiconductor device consists of a base body 1, a semiconductor element 2 fixed onto the base body 1, outer lead terminals 3, to which the electrodes of the semiconductor element 2 are connected, and a resin covering material 4 covering the parts of the semiconductor element 2, the base body 1 and the outer lead terminals 3, and a 2-30wt.%, inorganic substance or metallic powder having thermal conductivity of 50W/m.K or more is added to the resin covering material 4. |
