发明名称 BEND CORRECTION APPARATUS OF IC LEAD
摘要 PURPOSE:To provide a bend correction apparatus wherein the bend of an IC lead can be corrected accurately without causing a large flaw to the IC lead. CONSTITUTION:In a correction apparatus which is used to correct the bend to the transverse direction of each IC lead 101, a metal mold provided with a comb teeth-shaped claw 103 inserted between IC leads 101 is installed, and contact parts 103b which come into contact with only tip parts 101b of the IC leads 101 and which are used to expand the tip parts 101b by force are installed.
申请公布号 JPH06163782(A) 申请公布日期 1994.06.10
申请号 JP19920331141 申请日期 1992.11.17
申请人 SANYO SILICON DENSHI KK 发明人 WAKABAYASHI MASAAKI;UENO TOMIO
分类号 B21D3/10;H01L23/50;H05K13/00 主分类号 B21D3/10
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