HEAT-CONDUCTING RESIN, STRUCTURE AND MANUFACTURE OF SEMICONDUCTOR DEVICE USING THE RESIN,申请号JP19920317368-传众专利搜索

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发明名称	HEAT-CONDUCTING RESIN, STRUCTURE AND MANUFACTURE OF SEMICONDUCTOR DEVICE USING THE RESIN
摘要
申请公布号	JPH06163752(A)	申请公布日期	1994.06.10
申请号	JP19920317368	申请日期	1992.11.26
申请人	SEIKO EPSON CORP	发明人	HASHIMOTO NOBUAKI
分类号	H01L23/29;H01L23/31;(IPC1-7):H01L23/29	主分类号	H01L23/29
代理机构		代理人
主权项
地址

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