| 摘要 |
PURPOSE:To form an Au conductor on a ceramic wiring board with excellent bonding strength and high density by forming a predetermined pattern on the surface of a ceramic board with thick film Cu paste and applying a Cu conductor pattern or Au plating in part by using electroless Au plating solution. CONSTITUTION:Thick film Cu paste is printed in a predetermined place on the surface of a ceramic board 1 and then baked in the atmosphere of nitrogen after dried to form a thick film Cu conductor 2. Next, a photoresist dry film 3 is laminated on the whole surface of the ceramic board 1, and pattern exposure is performed by ultraviolet radiation through a photomask to develop the film 3 and dry it after cleaning by water. Next, the board is dipped into an electroless Au plating bath to form an Au plating layer 4 on the exposed surface of the thick film Cu conductor. Thereby, a ceramic wiring board in which a very fine Au conductor having substantially the same bonding strength as that of a Cu conductor is formed can be obtained. |
