| 摘要 |
PURPOSE:To prevent the deviation of solder from a soldering land in a direction opposite to the advancing direction during flow soldering. CONSTITUTION:An insulation resist 22 is formed on one surface of a board 11 on which a conductive pattern 20 has been formed. This insulation resist 22 is formed on the portion except soldering land 23, and also the insulation resist 22 is formed as a separated land 24 in a ring shape next to the edge of the soldering land 23 with a constant distance from said edge. When a printed wiring board 10 flows over the interface of a solder tank, the surface tension of solder is reduced by the insulation resist 22 at the separated land 24, so that the relative velocity of solder decreases at the inner soldering land 26. Because of this, the deviation of solder in the soldering land in the opposite direction of solder advancement can be prevented during flow soldering operation.
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