SEMICONDUCTOR DEVICE

摘要

PURPOSE:To eliminate separation at the interface between an insulating tape and a lead frame during reflow of solder of an LOC type semiconductor device (Lead On Chip package). CONSTITUTION:A rounded portion 10 is provided at the angled portion (corner portion) of a lead frame 2 in the vicinity of the center of a longer side of at least semiconductor chip 4. Thereby, a stress in such a direction as separating a lead frame from a memory chip which has been generated in the peripheral part of the corner portions of the lead frame 2 in the vicinity of the center area of the longer side of the memory chip 4 can be alleviated to prevent separation at the interface between the lead frame and insulating tape.