AUTOMATIC SOLDER ALIGNMENT AND BONDING METHOD

摘要

PURPOSE: To provide a method for bonding a semiconductor chip to a board while aligning automatically. CONSTITUTION: In the method for bonding a semiconductor chip 13 to a board 12 while aligning automatically, at least a fusion step is performed in a gaseous formic acid rich atmosphere. The formic acid rich atmosphere is preferably sustained during an automatic alignment step and a step for cooling and solidifying a solder element 23. Since no solid nor liquid flux is required, problem incident thereto can be avoided. The fusion solder element 23 is bonded rigidly to the bonding surface while being aligned normally thereto.