| 摘要 |
<p>PURPOSE:To prevent uneven coating and sticking of encapsulation agent to an element surface by saving labor through automation. CONSTITUTION:A feeder mechanism that carries a lead frame 20 mounted with a to-be-processed semiconductor element is provided with a carry claw connected to the first jig cylinder and a carry block 23 assigned on the lead frame, and the carry claw is lowered to hook the lead frame. The carry black 23 connected to the first rodless cylinder is carried by one lead frame. The lead frame at a specified position is, while held by a frame holder connected to the second jig cylinder, moved backward. Then a motor tilts the lead frame by a specified angle. These a series of operations are performed by an oscillating mechanism 22. In accordance with the lead frame at this position, an XY robot 31 waves a dispenser 32, and the inclined lead frame is automatically coated with the encapsulation agent by a needle filled with the encapsulation agent.</p> |
