| 摘要 |
PURPOSE:To cope with integrated-circuit packages having the diversified numbers of input/output pins and to improve the physical strengths of pads, which are connected to the input/output pins. CONSTITUTION:The pitches of pads 20 are changed in response to integrated circuit packages having the diversified numbers of input/output pins. The aligning pattern of base pads 30, which are provided in many numbers, is the common-divisor type pattern of the kinds of the pitches of the pads 20. The pads 20 are formed in the pattern corresponding to the actual pitches of the pads. At this time, the patterns are formed so as to cover at least one or more of the base pads 30. Therefore, the base pads 30, which are formed in the shared substrate and the like, can be used together with the customized pads 20.
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