| 摘要 |
PURPOSE:To provide an apparatus for treating the entire surface of a wafer evenly with liquid emitted from a nozzle without using means for keeping the wafer forcibly in a flat state even if the wafer has a warp. CONSTITUTION:A wafer 2 is supported on top of pins 22 fitted to a wafer support 18. A range finder 29 is provided for determining the distance D between the wafer 2 and a nozzle 6. Based on the measured distance D, the nozzle is moved up or down. The wafer, held on the pins, may warp; however, the distance from the nozzle is maintained constant as described above, so that the entire surface of the wafer is evenly treated with liquid emitted from the nozzle. |
