| 摘要 |
<p>PURPOSE:To provide a semiconductor chip bonder, which is improved to shorten the preheating time of a lead frame and also to be compact structure, and its semiconductor chip bonding method. CONSTITUTION:A semiconductor chip bonder 10 is equipped with a heating stage 34 for heating a semiconductor chip 26, a mount head 39 for pressing a lead frame 20 against the semiconductor chip on the heating stage, and a heater 12, which is arranged next to the heating stage so is to preheat the adhesive tape 24 stuck to the inner lead 22 of the lead frame. The heater is provided with a heating means 14 being so arranged as to preheat the adhesive tape by the heat of the inner lead being directly heated.</p> |
