| 摘要 |
PURPOSE:To provide a circuit board to be used suitably for a package for containing a hybrid integrated circuit device, a semiconductor element in which a resistor of a high resistance value can be formed on a narrow region. CONSTITUTION:A circuit board is formed by arranging a wiring layer 4 on an insulating board 1 and connecting a resistor 6 to be formed of a thin film forming technique to the layer 4, and the resistor 6 is formed in a mesh state. |
