发明名称 MULTILAYER INTERCONNECTION BOARD
摘要 <p>PURPOSE:To provide a multilayer interconnection board, in which a high-speed super conducting element like Josephson device can function effectively for an electric signal transferred in a circuit wiring at high speed. CONSTITUTION:In a multilayer interconnection board, an insulating film 2 made of high polymer material and a circuit wiring film 3 are alternately laminated on a base insulating board. Then, each circuit wiring film 3 on upper and lower sides are electrically connected through a through in the insulating film 2. The circuit wiring film 3 has a two-layer structure made of niobium 3a and niobium nitride 3b or a three-layer structure made of niobium nitride 3b, niobium 3a, and niobium nitride 3b.</p>
申请公布号 JPH06164151(A) 申请公布日期 1994.06.10
申请号 JP19920313321 申请日期 1992.11.24
申请人 KYOCERA CORP 发明人 TANAHASHI SHIGEO;KAWABATA KAZUHIRO;TAKEHARA RIYOUJI
分类号 H01L23/12;H01L39/02;H05K1/09;H05K3/46;(IPC1-7):H05K3/46 主分类号 H01L23/12
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