| 摘要 |
<p>PURPOSE:To provide a small semiconductor package that can realize correspondence to the increase in input/output signals and high heat radiation and prevent mulfunctions due to high-speed operation of a semiconductor chip. CONSTITUTION:A semiconductor package 1 is provided with a semiconductor chip 3 mounted therein, a multilayered aluminum nitride substrate 2 having wiring patterns (6, 7, 10, 11, 14, 15) connected electrically with the chip 3, and connecting terminals 4 that are electrically connected with the wiring patterns and are prepared on the opposite face to the chip mounting face of the substrate 2. At least one layer of the substrate 2 occupies a power source layer 13 or a ground layer 9 exclusively.</p> |
