LOW TEMPERATURE CO-FIRED CERAMIC (LTCC) HIGH DENSITY INTERCONNECT PACKAGE WITH CIRCUITRY WITHIN THE CAVITY WALLS

摘要

A unitized integrally fused multilayer circuit package having a substrate (11), walls (15, 17, 19, 21) disposed on the substrate (11) to form a central circuit package cavity (13), and circuit traces (51, 71) contained in the walls (15, 17, 19, 21).