发明名称 Electronic surface mount device - has electronic element with exposed flat surface in its upper region for drawing up device with suction nozzle
摘要 The surface mount device (SMD) includes a substrate (1). An electronic element (2) is mounted on the substrate. Several electrodes (4,5) are arranged on a surface of the substrate for the electrical connection of the electronic element. The electronic element has an exposed flat surface in its upper region (2a) which is used for sucking up the device with a suction nozzle (3). The electronic element is mounted in the middle of the substrate. ADVANTAGE - Can be miniaturised without requiring casing or moulding.
申请公布号 DE4340594(A1) 申请公布日期 1994.06.09
申请号 DE19934340594 申请日期 1993.11.29
申请人 MURATA MFG. CO., LTD., NAGAOKAKYO, KYOTO 发明人 MANDAI, HARUFUMI, NAGAOKAKYO;KATO, NOBORU, NAGAOKAKYO;SHIROKI, KOJI, NAGAOKAKYO;TOJYO, ATSUSHI, NAGAOKAKYO
分类号 H01F27/29;H01G4/224;H05K3/30;H05K13/04;(IPC1-7):H01F15/02;H03H7/01;H01G1/02;H01L23/12 主分类号 H01F27/29
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