Semiconductor housing with exposed connection elements - has upper section of housing body wider than lower section to expose inner connections on both side sections of lower surface of upper section

摘要

The semiconductor housing (11) has a connection frame with a support plate (16). Inner connections (12) are arranged in two rows on both side sections of the support plate. A semiconductor chip (15) fixed on the support plate has multiple bond spots with which the inner connections are connected by metallic wires (17). A housing body (11) is moulded to enclose both the connection frame and the chip. The housing body has upper and lower sections (11a,11b). The upper section is wider than the lower section by a predetermined width (W), to expose the inner connections on both side sections of the lower surface of the upper section. ADVANTAGE - Use of outer contacts becomes redundant, preventing mounting errors.