发明名称 SULFATE-FREE ELECTROLESS COPPER PLATING BATHS
摘要 Sulfate-free electroless copper baths comprising cupric ions, formaldehyde, formate ions, hydroxyl ions, a copper counterion, e.g. preferably a monovalent anion such as acetate, nitrate or formate, and copper chelant such as an alkali metal salt of aminotris(methylenephosphonic acid), biscarboxymethylaspartic acid, ethylenediaminetetra(methylenephosphonic acid), diethylenetriaminepenta(methylenephoshonic acid), gluconic acid, 1-hydroxyethylidene-1,1-diphosphonic acid, mucic acid, D-saccharac acid, tartaric acid and N,N,N',N'-tetrakis(2-hydroxypropyl)ethylenediamine are amenable to the recovery of copper, e.g. from purge streams, using the methods and apparatus including solvent extraction, e.g. employing hydroxamic acid extractants, anion filtration, ion-exchange and chelant precipitation.
申请公布号 WO9412685(A1) 申请公布日期 1994.06.09
申请号 WO1993US10779 申请日期 1993.11.09
申请人 MONSANTO COMPANY 发明人 MARTYAK, NICHOLAS, MICHAEL;MONZYK, BRUCE, FRANCIS;CHIEN, HENRY, HUNG-YEH
分类号 C23C18/40;(IPC1-7):C23C18/38 主分类号 C23C18/40
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