| 摘要 |
<p>A computer module (54) is disclosed in which a stack of glued together IC memory chips is secured to a microprocessor chip (48). The memory provided by the stack is dedicated to the microprocessor chip. The microprocessor and its memory stack are structurally combined to constitute an integrated computer module. Several structural combinations are disclosed, including direct bonding of the stack to the microprocessor, and bonding of the stack and microprocessor to opposite sides of a substrate. Electrical connections may be provided by several arrangements, e.g., solder bumps engaging aligned solder bumps, or wire bonds (52) connected between exposed terminal (46). Structural bonding may be accomplished in several ways, e.g., using adhesive, or using solder bumps.</p> |
