| 摘要 |
<p>A semiconductor die carrier (10) is provided for testing semiconductor circuits, the carrier (10), containing: a substrate (16) defining an opening and an outer perimeter (16); I/O pads (18) about the perimeter and an interconnect circuit (37) which includes individual electrical conductors formed in a polymer dielectric. The interconnect circuit overlays a top surface of the substrate and extends across the opening to form a flexible membrane (20) that spans the opening. Die contact pads connected to the conductors are disposed about the membrane with particles deposited on the die contact pads. A fence (23) upstanding from the membrane (20) and sized to receive a test die (22); a top cap (12) that rests upon the die when the die is received within the fence, a bottom cap (14) that rests against a bottom surface of the substrate; and a fastener (30) for securing the top cap to the bottom cap with the die in between are also provided.</p> |
