| 发明名称 |
DEVICE FOR COOLING SHEET ELEMENTS FOR POWER ELECTRONICS |
| 摘要 |
The invention relates to a device for cooling sheet elements (20) for power electronics, comprising a heat sink (10) provided with cooling fins (14). Said heat sink delimiting an enclosed cavity (12), against the interior wall (32) of which a power electronics element (20) is intended to be fixed. The heat sink (10) is hermetically sealable. |
| 申请公布号 |
WO9413012(A1) |
申请公布日期 |
1994.06.09 |
| 申请号 |
WO1993SE00824 |
申请日期 |
1993.10.11 |
| 申请人 |
ASEA BROWN BOVERI AB;BELWON, WALDEMAR;HESSLOW, GOESTA;MELBERG, TOMAS |
发明人 |
BELWON, WALDEMAR;HESSLOW, GOESTA;MELBERG, TOMAS |
| 分类号 |
H01L23/367;H01L23/40;H05K1/00;H05K1/03;H05K7/20;(IPC1-7):H01L23/34 |
主分类号 |
H01L23/367 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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