Integrated circuit test arrangement and method.

摘要

A method for testing a semiconductor device comprising the steps of a) sending an address signal from a device tester to a device under test, b) sending a test data signal from the device tester to parallel compare circuitry, c) storing the test data signal in the device tester, d) duplicating the test data signal in the parallel compare circuitry and storing the duplicated test data signals in the device under test in plural storage locations selected by the address signal, e) re-addressing the plural storage locations and reading out the stored duplicated test data signals from the plural storage locations to the parallel compare circuitry in response to a read signal, f) comparing said stored duplicated test data signals with one another in said parallel compare circuitry and producing a parallel compare circuitry output signal having a first state if all of said stored duplicated test data signals are at a similar voltage level corresponding to a same logic level or a second state if at least one of said stored duplicated test data signals has a voltage which corresponds to a different logic level as the others of said stored duplicated test data signals, and g) sending the parallel compare circuitry output signal to the device tester. This is also a test system 93 comprising a device under test 31 having plural data leads, a device tester 30, and parallel compare circuitry 91 coupled to both the device tester 30 and the device under test for implementing the described method.