发明名称 Process for reinforcing a semiconductor wafer and a reinforced semiconductor wafer.
摘要 <p>A process is used for reinforcing a semiconductor wafer (7), where remaining bubbles in a hot-melt adhesive can be reduced in number and in size. A reinforced wafer adhering to a reinforcing plate (5) with a heated and softened adhesive (6) is kept in a lower ambient pressure than a standard atmosphere for a predetermined period for deaeration, and is cooled under a higher pressure than the deaeration pressure. A reinforcing plate has a groove on its adhering face. <IMAGE></p>
申请公布号 EP0600392(A2) 申请公布日期 1994.06.08
申请号 EP19930119108 申请日期 1993.11.26
申请人 SUMITOMO ELECTRIC INDUSTRIES, LIMITED 发明人 NITTA, TOSHIYUKI, C/O OSAKA WORKS OF SUMITOMO
分类号 H01L21/02;H01L21/58;H01L21/68;(IPC1-7):H01L21/58 主分类号 H01L21/02
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