发明名称 |
Process for reinforcing a semiconductor wafer and a reinforced semiconductor wafer. |
摘要 |
<p>A process is used for reinforcing a semiconductor wafer (7), where remaining bubbles in a hot-melt adhesive can be reduced in number and in size. A reinforced wafer adhering to a reinforcing plate (5) with a heated and softened adhesive (6) is kept in a lower ambient pressure than a standard atmosphere for a predetermined period for deaeration, and is cooled under a higher pressure than the deaeration pressure. A reinforcing plate has a groove on its adhering face. <IMAGE></p> |
申请公布号 |
EP0600392(A2) |
申请公布日期 |
1994.06.08 |
申请号 |
EP19930119108 |
申请日期 |
1993.11.26 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LIMITED |
发明人 |
NITTA, TOSHIYUKI, C/O OSAKA WORKS OF SUMITOMO |
分类号 |
H01L21/02;H01L21/58;H01L21/68;(IPC1-7):H01L21/58 |
主分类号 |
H01L21/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|