发明名称 MANUFACTURE OF POSITIVE TYPE PHOTOSENSITIVE POLYMER COMPOSITION AND RELIEF PATTERN
摘要 PURPOSE:To provide positive type photosensitive polymer composition and a relief pattern with the unexposed area having less film wear and tear obtained by using it. CONSTITUTION:This is the manufacture of positive type photosensitive polymer composition containing salt compound of compound represented by the formula (R1 is an alkyl group of 1-3 carbon atoms, R2 is an alkylene group of 1-4 carbon atoms R3, R4 are alkyl groups of 1-3 carbon atoms, (m) is a 0-3 integer, (n) is a 1-3 integer, (p) is 0 or 1) with polyamide acid and quinone diazide compound, and a relief pattern using it.
申请公布号 JPH06161102(A) 申请公布日期 1994.06.07
申请号 JP19920310118 申请日期 1992.11.19
申请人 HITACHI CHEM CO LTD 发明人 NUNOMURA MASATAKA;UCHIMURA SHUNICHIRO;UEDA ATSUSHI;SUZUKI HIROSHI;SATO NINTEI
分类号 C08L79/08;C09D179/08;G03F7/022;G03F7/037;G03F7/039;H01L21/027;H01L21/30;H01L21/312;(IPC1-7):G03F7/022 主分类号 C08L79/08
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