| 摘要 |
Method and apparatus for cutting a pattern of a printed wiring board and method and apparatus for cleaning a printed wiring board are provided, wherein a laser beam is irradiated onto a printed wiring board to evaporate the irradiated portion, to thereby cut a pattern or clean the printed wiring board. A laser beam is irradiated onto a cutting spot of the pattern of the printed wiring board to volatilize and remove the cutting spot, and a laser beam having a lower energy density and a larger irradiation area than that used for the pattern cutting is applied to a region of the wiring board around the cut spot, to remove molten matter adhering to that region. A suction nozzle for sweeping a surface region including the cut spot of the printed wiring board and for withdrawing molten matter adhering to the region, or a tape feeding apparatus by which an incombustible sheet or tape is disposed in close contact with the cutting spot of the pattern of the wiring board for collecting particles scattered during the pattern cutting is provided, whereby defective insulation attributable to adhesion of molten matter to the wiring board during the pattern cutting is prevented. Laser beams are applied to the printed wiring board obliquely from two directions to dry-clean the wiring board, whereby solder balls can be removed and defective pin contact is prevented without entailing an increase of the initial cost or running cost.
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