| 摘要 |
A shuttle assembly for an injection molding machine is provided. The shuttle assembly includes a shuttle-support unit adapted to be attached to the machine frame and a shuttle-mold interfacing unit, slidably coupled to the support unit. Mold-coupling members are provided for removably coupling a first movable mold platen unit and a second mold platen unit to the shuttle-mold interfacing unit. During operation of the shuttle assembly, a shuttle-drive unit selectively reciprocally indexes the shuttle-mold interfacing unit in a preferably horizontal shuttle-travel path between (i) a first shuttle position whereat the first movable mold platen unit, when coupled thereto, is situated at a first unloading/loading position, and the second movable platen unit, when coupled thereto, is situated at a clamping position; and (ii) a second shuttle position where the first movable mold platen unit, when coupled thereto, is situated at a clamping position, and the second movable platen unit, when coupled thereto, is situated at a second unloading position. In the preferred embodiment, the first unloading position and the second unloading position are located on opposite sides of the clamping position.
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