Conditioning of a substrate for electroless plating thereon

摘要

A dielectric substrate is conditioned for subsequent electroless plating thereon by contacting with a catalytic metal salt and then with a reducing agent and with an electroless metal plating bath followed by contacting with a second catalytic metal salt. In addition, a dielectric substrate is conditioned for electroless plating thereon by obtaining a substrate of a dielectric material that contains metal particles therein and contacting with a catalytic metal salt.