发明名称 |
Plating rate improvement for electroless silver and gold plating |
摘要 |
An electroless silver or gold plating solution comprising a noncyanide metal complex, a thiosulfate, a sulfite, and at least one amino acid. These electroless plating solutions containing an amino acid exhibit an accelerated plating rate compared to identical solutions lacking amino acids.
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申请公布号 |
US5318621(A) |
申请公布日期 |
1994.06.07 |
申请号 |
US19930104723 |
申请日期 |
1993.08.11 |
申请人 |
APPLIED ELECTROLESS CONCEPTS, INC. |
发明人 |
KRULIK, GERALD A.;MANDICH, NENAD V.;SINGH, RAJWANT |
分类号 |
C23C18/42;(IPC1-7):C23C18/31 |
主分类号 |
C23C18/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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