| 摘要 |
PURPOSE:To prevent the nonuniformity of a colored layer by forming the colored layer consisting of a colored ceramic compd. selected from SiC, TaN, etc., on the surface of an AlN sintered compact by sputtering. CONSTITUTION:An IC chip 4 mounted on a ceramic package 2 is sealed with a cap 5 and a ring 6, and the package 2 is electrically connected to a printed circuit board 1 through a connector pin 7 erected on the mounting surface S1 of an AlN sintered compact substrate 3. A target of the colored ceramic compd. selected from high-purity SiC, TaN, etc., is set in the reaction vessel of a sputtering system. The reaction vessel is filled with gaseous Ar, a specified power is supplied to cause sputtering, and a colored layer 8 of the colored ceramic compd. is formed on the surface S2 of the substrate 3 on which the chip is not mounted in >=0.1mum, preferably 0.5-5mum, thickness. Consequently, the surface of the substrate 3 is colored with a uniform deep color without lowering the high heat conductivity. |
