| 摘要 |
PURPOSE:To highly accurately slice a work such as semiconductor material or the like. CONSTITUTION:A work W is fed normal or oblique to the plane of a rotary blade 11 with a work feeding device 20. The work W is bondingly fixed to a workblock 21 supported by the work feeding device 20. The workblock 21 is intermittently fed by the predetermined divided amount toward the blade 11. On a work guiding mechanism 40 for guiding the work W, driving parts 41, each of which abuts against the side surface and rotates, are arranged further up near to the blade side tip part of the guiding mechanism 40. Thus, since the work W is supported up near to the tip of the work W by the driving part 41 or driving rollers and the like, effects due to deflection, vibration and the like are suppressed, resulting in allowing to slice into a wafer, which has the constant plate thickness and no saw mark. |
