EXPOXY RESIN COMPOSITION

摘要

The epoxy resin compsn. for sealing semiconductor components comprises: (A) 100 wt.pts. of the special multi-functional epoxy resin of formula (I); (B) the amt. of novolac type phenol resin having 0.1-10 equivalent ratio of the epoxy gp. of the epoxy resin (I) to the phenolic hydroxy gp. of the phenol resin; (C) the curing accelerating agent in the amt. having 0.04-0.50 component ratio of phosphorus atom w.r.t. 100 wt.pts. of (A)+(B); (D) 30-90 wt.% of the inorg. filler w.r.t. total last composn.; and opt. other additives. In formula, R1 is H, halogen or C4-18 branched or straight alkyl; R2 is H or C4-18 branched or straight alkyl; n is 1-5.