PROCESS FOR PREPARING COMPOSITE ISOTROPIC COPPER-BASED MATERIALS BY SLIP CASTING, HAVING A LOW THERMAL EXPANSION COEFFICIENT AND HIGH ELECTRICAL CONDUCTIVITY AND THEIR USE

摘要

The invention relates to a process for preparing isotropic slip-cast copper-based composites having a low coefficient of thermal expansion and a high electrical conductivity. The starting material here is a mixed slip which contains a powder component having a high electrical conductivity and a further powder component having a low coefficient of thermal expansion, a solvent, a plasticiser and, if appropriate, further additives required by the system. The mixed slip is cast as a green strip onto a suitable substrate, burnt out, sintered and processed via cold-rolling steps and annealing steps to give a solid strip. The composites slip-cast according to the invention are used preferably for the manufacture of electronic components.