Automatic removal system for electronic components from circuit board - has board scanned by optical system to identify components and to provide commands for input to robot gripper

摘要

The automated system is used for the removal of electronic circuit components (7) that are soldered onto a circuit board (1). The board is moved under the field of vision of an optical sensing system, e.g. CCD camera. The images of the components are compared with data bank information and the components identified. The positional location is fixed relative to a reference point and commands transmitted to a handling system. A gripper (A) holds the component and the soldered is melted by either an infrared source (11) or by use of a heated liquid. ADVANTAGE - Provides identification and location of components for removal.