| 发明名称 |
Expand tape |
| 摘要 |
An expand tape used for dicing a semiconductor wafer includes an expandable film, and a preform layer which is provided on the expandable film and is used at die-bonding chips of the diced semiconductor wafer to a frame.
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| 申请公布号 |
US5316853(A) |
申请公布日期 |
1994.05.31 |
| 申请号 |
US19910816398 |
申请日期 |
1991.12.27 |
| 申请人 |
ROHM CO., LTD. |
发明人 |
SHIBATA, KAZUTAKA;MURAKAMI, YUTAKA |
| 分类号 |
H01L21/301;H01L21/58;H01L21/68;(IPC1-7):B32B15/08;B32B15/04 |
主分类号 |
H01L21/301 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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