| 摘要 |
PURPOSE:To achieve both of reliability at holding or delivery of a substrate and throughput at high level. CONSTITUTION:This device is equipped with a pump 10 being a suction source, a transfer chuck 1 for holding a wafer substrate 20 by suction, a connection line 5 connecting the pump 10 with the chuck 1 and containing a plurality of parallel lines on the way, and valves 71 and 72 provided in the plural lines, and the conductance of the connection line is adjusted by selecting either line, controlling the opening and closing of the valves 71 and 72 by controllers 17 and 18, whereby the optimum suction pressure of the chuck 1 is set. Moreover, also as regards a wafer chuck 2, the optimum suction pressure is set, with the conductance of a connection line 6 adjusted the same. The optimum suction pressure of the chucks 1 and 2 is set at every operation such as the hold, delivery, etc., of a substrate. |
