| 摘要 |
PURPOSE:To prevent the generation of thin resin burrs on bumps by making the height of a space lower than that of the bumps and positioning a semiconductor element in the space while the upper surfaces of the bumps are press- contacted with the internal surface of a top force. CONSTITUTION:In the first process, a semiconductor element 1 provided with bumps 3 is positioned in a space constituted of a top and bottom forces 8 and 9. In the second process, the element 1 is sealed with a resin 6 by injecting and hardening the resin 6 into and in the space. In the first process, the height H3 of the space constituted of the forces 8 and 9 is specially made lower than that H2 of the bumps 3. Therefore, the element 1 provided with electrodes 2 and bumps 3 is held between the forces 8 and 9 and the forces 8 and 9 press the bumps 3 against each other when the top force 8 is clamped to the bottom force 9. |
