| 摘要 |
<p>PURPOSE:To improve packaging efficiency related to a resistor in a printed wiring board. CONSTITUTION:A hole 4 for a lead wire on a terminal is provided on an insulation printed circuit board 1 and a land 3 at the opening peripheral edge part of the hole 4, a conductor pattern 2 are formed on the surface of one side. The edge part of the conductor pattern 2 is formed as a band-shaped circle in the form for including a land 3, and two wedgesurface-shaped layer-shaped resistors 5 are formed on the insulation printed circuit board 1 in a form for burying the band-shaped circle and the hollow part with the land, where the shape of the resistor 5 is not a problem and the total area becomes an important factor for determining the resistance. In a first embodiment, the layer-shaped resistor 5 is connected without taking up space between the conductor pattern 2 and the land 3.</p> |
