| 摘要 |
PURPOSE:To improve a mold separability, cracking-resistant properties, a heat- resistant reliability, etc., by a method wherein special resin composition which contains polymaleimide compound, phenol allylide resin, one or both of aliphatic carboxylic acid and metallic salt of aliphatic carboxylic acid and inorganic fillers is employed for sealing. CONSTITUTION:Phenol allylide resin which is used with polymaleimide compound functions as the curing agent of the polymaleimide compound. Curing catalyst enhances the adhesion between sealing resin and a semeconductor chip and between sealing resin and a lead frame and reduces curing time. Further, the improvement effect of the separability between the sealing resin and a mold, cracking-resistant properties and a moisture-resistant reliability can be obtained by at least one of aliphatic carboxylic acid and metalate of aliphatic carboxylic acid. Moreover, inorganic fillers improve the bonding strength between the sealing resin and the semiconductor chip and between the sealing resin and the lead frame. With this constitution, a semiconductor device which has excellent mold separability, cracking-resistant properties, heat-resistant properties and moisture-resistant reliability can be obtained. |
