| 摘要 |
<p>PURPOSE:To provide an intelligent transistor module which has a structure in which a stress is not applied to a connecting part of an outer lead terminal to a circuit pattern due to thermal expansion of a gelled resin and reliability is improved. CONSTITUTION:A circuit pattern 23 is formed on an insulation board 21, and electronic elements such as a semiconductor element 25, etc., is connected to the pattern. An electric element placing region on the board 21 is surrounded by a frame 10 formed of an insulator. Gelled resin 11 is fed inside the frame 10, and a stress due to thermal expansion of the resin 11 is not applied to an outer lead terminal 28 to be connected to an outer circuit pattern of the frame 10.</p> |
