| 摘要 |
PURPOSE:To solder external leads easily and reliably to an electronic circuit substrate of an image forming device and the like. CONSTITUTION:External leads 6 are set on substrate electrodes 4 arranged at short pitch on a substrate 2, and a cream solder layer 10 is applied, and it is heated by a hot blast heater 12. The melted cream solder layer 10 contracts by surface tension, and moves to a soldering part between the substrate electrodes 4 and external leads 8 from an insulating film 8 of low wettability, and is removed from the insulating film 8, and soldering is carried out. |
