| 摘要 |
PURPOSE:To provide an MCP semiconductor device which has enhanced interconnection between semiconductor chips and semiconductor element reliability as well by allowing a part of a lead wire to extend to the other side from one side without contact with the main plane of at least one semiconductor element. CONSTITUTION:An MCP semiconductor device provides a bonding wire 25 which electrically connects inner electrodes 15 and 18 out of a first semiconductor element 11 and a second semiconductor element 12 to a lead wire 19 of a lead frame 20 and sealing resin which forms a resin package as well. A part of the lead wire 19 extends from one side to the other side of the semiconductor element without contact with the main plane of at least one semiconductor element so that the lead wire 19 may cross a chip in a three-dimensional manner. As a result, some of the inner electrodes 15 and 18 are connected to common lead wires 19d by means of the bonding wire 23. It is, therefore, possible to lower lead inductance and reduce a noise as well. |
