发明名称 WIRE FOR BONDING SEMICONDUCTOR ELEMENT AND ITS MANUFACTURE
摘要 PURPOSE:To provide a bonding wire with which the number of working times for exchanging and cleaning a capillary and clamper can be reduced even when the bonding wire is very thin and long and the manufacturing method of the bonding method. CONSTITUTION:(1) The total amount of organic carbon on the surface of an Au wire which is manufactured through an ordinary process by using various kinds of lubricants in the wire drawing process and has a diameter of 25mum is reduced to 50-1,500mug/m<2> by washing the wire for 1-20 seconds with hot pure water of 80 deg.C before annealing. (2) The total amount of organic carbon on the surface of an Au wire which is manufactured through an ordinary process by using a lubricant composed of a natural resin in the wire drawing process and has a diameter of 25mum is reduced to 50-1,500mug/m<2> by performing annealing after the total amount of organic carbon is reduced to <=50mug/m<2> by electrolytically cleaning the wire for 5 seconds.
申请公布号 JPH06151497(A) 申请公布日期 1994.05.31
申请号 JP19920299916 申请日期 1992.11.10
申请人 TANAKA DENSHI KOGYO KK 发明人 ABE TAKEAKI;IGA SUKEHITO;NAGAMATSU ICHIRO
分类号 C23G1/00;H01L21/60 主分类号 C23G1/00
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