| 摘要 |
PURPOSE:To enable forming of organic insulation film so as to simplify manufacture process, compared with conventional technology, relating to forming of a protective film on a sealing print pattern. CONSTITUTION:Relating to a print pad 2 for leading out wiring and a sealing print pattern 3, formed on a ceramics substrate 1, after an organic insulation film (PIQ film) 8 is formed over the entire surface, a photosensitive organic insulation film (Photo-PIQ film) 11 is formed, and then the film is selectively patterned, further, with the photosensitive organic insulation film 11 used as a mask, the organic insulation film 8, base material, is etched, so that a protective film consisting of an organic insulation film and a photosensitive organic insulation film is formed on the sealing print pattern 3. |
