| 摘要 |
PURPOSE:To provide a means far manufacturing a multilayer wiring board, using inter-layer connection, which can respond to variation in height of wiring pattern, connects to a desired wiring pattern, and requires no cover film or plating process, and further can respond to thinner circuits. CONSTITUTION:Between two or more double-side wiring boards, each of which has a wiring pattern 2 formed, while projecting, on an insulation substrate 1, an adhesive layer, conductive in the direction of thickness, that consists of conductive particles 5, whose particle size is smaller than the distance between adjoining wiring patterns 2, and a bonding agent 6, is assigned and then heated and pressurized for forming laminated one body, inter-layer connection thus established. |
