| 摘要 |
PURPOSE:To supply a power-supply voltage whose strain is small and to comply with the high speed of a circuit by a method wherein a high-permittivity ceramic layer is interposed between a power-supply layer and a grounding layer. CONSTITUTION:A green sheet 1 is formed of a raw-material powder of lead zircotitanate, holes 2 are made, and a conductor paste 3 is applied. Then, four green sheets 1 are stacked, they are baked, a high-permittivity ceramic board 5 provided with vias 4 is manufactured, and conductive films 6 are applied to both faces of the board 5. Then, the conductive films 6 are patterned, a conductive-film pattern 6', for land use, which is connected to the vias and a conductive-film pattern 6'' which is connected to a power-supply interconnection and a grounding interconnection are formed. Then, polyimide films 7 are applied to the surface and the rear of the board, the polyimide films 7 in positions corresponding to the vias 4 are removed, and an electrode pattern 8 is formed on the rear. Then, signal-pattern conductive films 9X, 9Y are formed by making use of polyimide films 7b, 7c on the surface as interlayer insulating layers, a grounding conductive film 6g is formed on them, a polyimide film is applied, and an electrode pattern is formed. |
