| 摘要 |
PURPOSE:To make a defective chip or nondefective chip easily removable from a substrate at the time of removing the defective chip or replacing the nondefective chip with another chip. CONSTITUTION:A conductive bonding agent 14 containing solder particles is used and, at the time of bonding a semiconductor chip 3 to a substrate 1, the substrate 1 is heated to a temperature lower than the melting point of the solder. At the time of removing a defective chip or replacing a nondefective chip with another chip, the substrate 1 is heated to a temperature higher than the melting point of the solder.
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