| 摘要 |
<p>PURPOSE:To provide a semiconductor device, which has structure for eliminating the physical influence such as stress, etc., that an envelop making material gives a semiconductor element and a metallic wire, and its manufacture. CONSTITUTION:A hollow 7 is made by putting a bottom envelope 8 and an upper envelope 9 together from the rear and the surface of a lead frame thereby catching it between, in such a way as to surround the region including the semiconductor mounting part 2 of the lead frame, an electrode terminal 3, a semiconductor element 1, and a metallic wire 5, and mounting those in inert gas atmosphere dried enough, by adhesion method or the like. And, the complete envelope where the bottom envelop 8 and the upper envelop 9 are bonded together is sealed with resin envelop 10 consisting of epoxy resin by low-pressure transfer molding method as secondary sealing.</p> |
