| 摘要 |
<p>PURPOSE:To provide a three-dimensional printed wiring molded object where a molded member and a plurality of printed wiring boards are formed in one piece and its manufacturing method. CONSTITUTION:A first conductive pattern layer 12a which is formed selectively and a second conductive pattern layer 12b which is formed at the upper layer of the first conductive pattern layer 12a and is at least partially connected to the first conductive pattern layer 12a electrically are formed. Also, it has a three-dimensional printed wiring circuit 14 consisting of an insulation pattern layer 13 formed at the interlayer excluding one part of the first conductive pattern layer 12a and the second conductive pattern layer 12b and the three- dimensional printed wiring circuit 14 is formed on the surface of a mold member 11 which is machined to a solid shape.</p> |
