Corrosion inhibition with CU-BTA

摘要

A corrosion protecting film layer is formed on a non-passivating non-noble metal, such as cobalt, by placing the metal in a dilute solution of Cu+2 ions and benzotriazole (1 H-BTA). Exposure of the metal to a solution containing Cu+2 and 1 H-BTA results in a spontaneous interaction of Cu+2 and the metal to produce a film layer of Cu(I) BTA on the metal surface to create a permanent corrosion protection for the metal. A borate buffer, such as boric acid and a borate, can be added to the solution to adjust the pH of the solution to be in the range between 8 and 9.