MULTI-LAYER SUPERCONDUCTING CIRCUIT SUBSTRATE AND PROCESS FOR MANUFACTURING SAME

摘要

MULTI-LAYER SUPERCONDUCTING CIRCUIT SUBSTRATE AND PROCESS FOR MANUFACTURING SAM A multi layer superconducting circuit substrate, comprising insulating layers and interconnection patterns of a superconductive ceramic material located between the insulating layers, the patterns of the superconductive ceramic material being connected via through-holes of the superconductive ceramic material, is provided. The patterns of the superconductive ceramic material is preferably encapsulated with a metal of gold, silver, platinum or an alloy thereof.